After the price fight in recent years, the COB market is gradually stabilizing, and the price reduction space is very limited. The inverted COB with smaller light source and higher light efficiency is expected to become the next market trend.
In order to compete for greater market share, and at the same time pass on cost pressure, major manufacturers have focused their attention on flip chip, in terms of its high profit margin (according to industry insiders, profit margins will reach 300%-400%) ()), and thus attracted many COB package manufacturers to layout the inverted COB field.
In the past two years, the COB market has maintained a growth trend. According to the data of the High-tech Research Institute LED Research Institute (GGII), the sales volume of COB products in 2015 accounted for about 30% of the overall light source, replacing the traditional patch market by 30%-40%. Market share.
In 2016, the overall LED market is generally warming up, which is also a strong driving force for the development of the COB market.
With the increasing demand for cost in the entire industry chain of LEDs, flip-chip technology is becoming more and more popular, and everyone is also focusing on the flip-chip COB market. It is understood that COB is a bare chip technology for LED lighting. A plurality of LED chips are placed in a small unit to form a COB LED lighting module. This is also a relatively new technology for LED packages, which mount LED chips directly on the substrate to form an array of LEDs on the LED lighting module.
In the commonly used COB light source products, the chip accounts for more than 50% of the cost of the light source, and some may even be close to 70%. The COB price is rapidly reduced, which depends largely on the downward adjustment of the chip price.
True, light efficiency is a very important indicator, but COB has a natural advantage, that is, light quality is better than SMD. It has greater advantages in the control of optical color quality in optical design effects, but the industry often ignores this advantage and is limited to the indicators of light efficiency and energy saving.
The current COB light source technology is becoming more and more mature, and the market has a stronger demand for COB light source. The packaging manufacturers no longer stay in the initial technical solution stage, and turn to the cost-effective stage of pursuing high-quality, high-efficiency COB, with high performance and high quality. The performance of flip-chip solderless gold-line packaging technology has also become a new direction for COB light sources. Since the second half of last year, a number of high-efficiency, ultra-low thermal resistance flip-chip LED integrated light sources have been introduced, and they will become an important market direction in 2016, and the demand for flip-chip light sources will gradually increase.
Major manufacturers in the market have also launched their latest products, such as the new flip-chip COB products introduced by Hongli Optoelectronics, the index is >95, the power can cover 15-80w; Dehao Runda ceramic-based flip COB, Ra=95, The luminous efficacy is up to 100lm/W; the high-intensity ceramic flip-chip cob of the same side photoelectric, and the superconducting aluminum substrate COB light source of flip-chip soldering-free gold-line packaging technology introduced by Liyang Optoelectronics.
Indeed, the COB module will enable more functional integration, such as integrating the power supply into the light engine for de-energization and super-power integration; the other is the application in the segmentation field, which requires many uniquely designed light sources, such as intelligent control. Module integration, the most important spectral integration in medical lighting. These require high-end professional technology and the future development of COB.
Overall, regardless of the trend of flip-chip COB, it is an effective means to solve the current decline in package gross profit and seek new profit growth points.
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