The lecture was hosted by Zhou Xuejun, Marketing Director, Asia Pacific, Philips Lumileds
AIXTRON senior process engineer Dr. Sun Yijun, Veeco Greater China Director Zhang Qinglin, Philips Lumileds China Technical Solution Manager Dr. Shi Lei, Wuhan Diyuan General Manager Dong Zhijiang, Zhen Mingli LED Business Unit General Manager Ye Guoguang, Inspur Huaguang Electronic Technology Director Wang Chengxin Dr. Li Dongsan, General Manager of Northern Microelectronics, Dr. Lu Qitao, Chief Technology Officer of Dazu Laser Technology, Xu Haibin, Director of Laser Technology, Suzhou Delong, and Dr. Liang Bingwen, Research Fellow, Suzhou Institute of Nanotechnology and Nano-Bionics, Chinese Academy of Sciences gave a wonderful speech by Philips Lumileds Asia Pacific District Marketing Director Zhou Xuejun presided over.
meeting venue
Sun Yijun: The trend of MOCVD technology is the combination of multi-chip technology and large-size wafers.
AIXTRON senior process engineer Sun Yijun made it clear that MOCVD can only be applied in large-scale production with multi-chip technology. The future trend of MOCVD will be the era of combining multiple technologies and large-scale wafer technology. The next era will be More pieces and larger sizes. AIXTRON's latest products, the G5 and Crius II, are designed to achieve this goal. The G5 is available in 56 x 2", 14 x 4", 8 x 6", 5 x 8" configurations.
Sun Yijun pointed out that 2 inches is still the absolute mainstream in the mainland market. Although 4 inches has achieved production, in general, 4 inches is not mainstream in the whole epitaxial production, but in the near future, the mainland will appear in the future. Inch, 6 inches, this is an absolute trend.
Dr. Sun Yijun, Senior Process Engineer, AIXTRON
Zhang Qinglin: Veeco has the responsibility to reduce the cost of producing MOCVD
Zhang Qinglin, director of Veeco Greater China, said that LED backlighting is the biggest contributor to LED growth in the past two years. In the long run, the residential lighting market is one of the biggest drivers of LED growth. With the rapid development of LED, the yield and capacity of MOCVD is very important. This will involve the cost of the whole LED. How much does it cost for consumers to buy the final LED product? MOCVD occupies a very important position. Veeco has the responsibility to produce The cost of MOCVD is reduced, allowing customers to produce the highest quality epitaxial wafers in the shortest possible time.
Zhang Qinglin, Director of Veeco Greater China
Shi Lei: Philips Lumileds up to 2000 lm/$ in 2015
In the speech, Dr. Shi Lei, Technical Program Manager of Philips Lumileds China, said that according to the US Department of Energy, LEDs can achieve 1000 lm/$ in 2015, and Philips Lumiled expects to achieve 2000 lm/$ in 2015. This is why Philips Lighting is so optimistic that the proportion of LED lighting in the global general lighting market will rise to 50% in 2015 and 75% in 2020.
Shi Lei believes that when mass production of 100-120 lm/W is not a problem, light quality will become an increasingly important issue, especially when entering indoor lighting, color consistency, color indifference, high color rendering index. These are the problems that indoor lighting must face.
Philips Lumileds has a large factory dedicated to testing, and millions of LEDs produced every day are tested. Its new product, LUXEON Rebel, has been analyzed with more than 5 million test conditions for product reliability, lumen maintenance, etc., and its efficacy is consistent over the typical operating temperature range.
Dr. Shi Lei, Technical Solutions Manager, Philips Lumileds China
Dong Zhijiang: Several ways to improve the efficiency of light extraction
Dong Zhijiang believes that LED enters lighting is an inevitable trend. At present, LEDs with competitive advantages must have high luminous flux and high cost performance. Factors affecting the luminous efficiency of LED chips: luminous efficiency, internal quantum efficiency, and light extraction efficiency; several methods for improving the light extraction efficiency of the chip are: patterning the substrate, reducing the light propagation path, reducing light absorption, and increasing light. Extraction efficiency (increased by 10%-30%); adding reflective layer on the back side of the substrate to reduce backlight loss; surface roughening can improve light extraction efficiency by 9%-30%; deposit a special protective layer on the surface of the chip to refract The rate is between the contact electrode and the encapsulation material to increase the light extraction efficiency.
Dong Zhijiang said that Diyuan Optoelectronics' 100lm/W lighting high-power chip has reached industrialization. After 1000 hours of high-temperature accelerated aging (450mA) test, it is tested under 350mA conditions, and the chip light decay of each manufacturer is close (about 4%).
Dong Zhijiang, general manager of Wuhan Diyuan
Ye Guoguang: A new round of mergers and acquisitions will occur in 2012
Ye Guoguang said in his speech that the expansion of MOCVD in 2010 will not meet the current demand. It is expected that the expansion of MOCVD in the second quarter of 2011 will meet the demand for LCD backlighting. From the third quarter of 2011 to 2012, LED will Due to the shortage of supply due to the development of the LED lighting market, a new round of mergers and acquisitions will occur in 2012, and the mainland market will undergo great changes. The next two or three years will be competition for vertical integration and fine division of labor, vertical integration and horizontal integration.
Dr. Ye Guoguang, General Manager of Zhen Mingli LED Business Unit
Wang Chengxin: Inspur Huaguang established 90 sets of MOCVD production lines
Wang Chengxin said in his speech that Inspur Huaguang plans to invest a total of 5 billion yuan, set up four R&D and production bases in Jinan, Weifang and Linyi, and establish 90 sets of MOCVD epitaxial wafers and supporting tubes through coordinated division of labor and supporting construction. The core production line has an annual production capacity of 4 million pieces of LED and LD epitaxial wafers, 80 billion cores, 10 billion devices, 3 million sets of application products and 300,000 SiC substrates. Established the largest and world-renowned LED and LD industrialization base in China. High-power GaN LED dies in the next December-August target: mainstream product efficacy >110lm/W, laboratory level 130lm/W.
Dr. Wang Chengxin, Electronic Technology Director, Inspur Huaguang
Liang Bingwen: Reducing costs is the key
Liang Bingwen said that the semiconductor lighting industry has entered a period of rapid development, cost is the key, product quality is a challenge, IP is the bottleneck and risk to the international market, the talent team and the company's operating system are the way out, the key industrialization technology is the opportunity, the government has the decision effect.
With the advancement of technology, the further improvement of light efficiency is a matter of course. In 2020, the LED light performance of mass production can reach 200-250 lm/W. LEDs must be popularized, and the most important thing is cost. To reduce costs, the first is scale; the second is technology.
Dr. Liang Bingwen, Research Fellow, Suzhou Institute of Nanotechnology and Nano-Bionics, Chinese Academy of Sciences
Li Dongsan: Application of ICP dry etching in LED manufacturing process
Li Dongsan, general manager of Northern Microelectronics, introduced the different process characteristics, performance and requirements of sapphire patterned substrate (PSS) etching and GaN etching. He said that ICP dry etching is the key equipment in the LED industry chain, while the northern micro The electronic ELEDETM 330 LED etching machine uses the more precise design requirements of the IC process to achieve a higher performance etching process in the LED field to further improve the luminous efficiency of the LED chip.
Li Dongsan, general manager of North Microelectronics
Han's Laser: LED chip development requirements for laser technology
Dr. Lu Qitao, Chief Technology Officer of Dazu Laser Technology, introduced the LED chip process laser processing technology: P-second laser processing technology, laser stealth cutting technology, and laser substrate stripping technology. He said that with the development of LED wafer sizes from 2 inches to 4 inches and 6 inches, it poses new challenges to epitaxial wafer cutting technology and laser processing.
Future LED chips must be developed in the direction of improving luminous efficiency. With some new epitaxial materials, LED chips emitting white light can be directly fabricated.
Dr. Lu Qitao, Chief Technical Officer, Han's Laser Technology
DeLong Laser: Progress in Laser Wafer Technology for LED Wafers
Xu Haibin, Director of Suzhou Delong Laser Technology, introduced five kinds of LED wafer laser dicing technology: semi-automatic and fully automatic UV laser dicing technology; copper-tungsten alloy substrate laser cutting technology; high-speed dicing technology for sidewall corrosion process; ultrashort pulse Laser fine cutting technology; semi-automatic LED wafer splitting technology, and a detailed description of their respective characteristics and processing capabilities.
Suzhou Delong Laser Technology Director Xu Haibin
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