The 2017 Mobile World Congress (MWC 2017) will debut in Barcelona, ​​Spain from February 27th to March 2nd. Many mobile devices and wireless technology-related manufacturers will release a new generation of products and programs. Qualcomm will release new products for the Internet of Things (IoT), 5G and LTE upgrades at this MWC to meet the increasing demand for wireless data transmission in the mobile field.
According to Forbes, Qualcomm recently announced that its Sub-6 GHz 5G new air interface (NR) wireless networking technology based on the 3GPP standard has successfully completed its first 5G networking through its own hardware devices. It is expected that the Sub-6 GHz 5G NR will eventually become the technical standard for high-throughput production of 5G chips. Qualcomm will showcase its 5G NR massive MIMO TDD Sub-6 GHz technology at this MWC show, demonstrating the technological advantages of massive MIMO and high-speed networking with Qualcomm's 5G NR networking technology Speed ​​advantage.
Qualcomm will also show how to operate Non-Line-Of-Sight (NLOS) technology between the device and its nodes with its own mmWave technology, which will perform outdoor and indoor technical operation demonstrations and simulations. The operation of seamless switching between nodes when the vehicle travels at 30 mph. This technology demonstration will be worthy of attention because it is the first time in the world to conduct mmWave or 5G wireless technology demonstrations for everyday life such as traveling vehicles or building walls.
RF front-end (RFFE) technology suitable for 5G era applications, it has taken a long time to cooperate with TDK to launch a gallium arsenide (GaAs) power amplifier module to enhance its RFFE technology performance. RF360 Holdings, a fully integrated system for supplying components such as RFFE modules to Qualcomm's own built-in modems and adapters, including the introduction of the new multimode multi-frequency power amplifier module (QPA) and the new front-end module (FeEMiD) And an antenna diversity receiving module (DRX).
In addition, Qualcomm also introduced a new antenna tuning QAT355x series chip for use with the new generation Snapdragon 835 system single chip (SoC) with built-in impedance tuner, aperture tuner and an antenna diversity switch. The new power amplifiers and other wireless networking system related components will eventually help Qualcomm to launch a complete solution from Modem to antenna, which can improve integration, reduce design complexity, and respond to increasingly complex 4G and 5G. RF environment.
For Gbps-class LTE high-speed transmission technology, Qualcomm also announced the Snapdragon X20 LTE chip. The theoretical maximum transmission speed can be as high as 1.2Gbps. The upload speed is the same as that of the Snapdragon X16 LTE chip built into the Snapdragon 835 processor, reaching 2 x 20MHz. Or 150Mbps level; Snapdragon X20 also supports Authorized Auxiliary Access (LAA), the first discrete Modem chip produced by Qualcomm for 10nm process.
Qualcomm Snapdragon 210 LTE chips also support the new generation of 3.5GHz CBRS shared spectrum in the United States, as well as supporting dual SIM cards and dual VoLTE, suitable for the dual SIM card models of the Asian market and the VoLTE specifications that telecom operators are embracing.
After the rise of the Internet of Things application, Qualcomm will not continue to develop its own IoT chip technology to meet the needs of the market. Qualcomm will also announce the Snapdragon 210 processor supporting the Android Internet of Things platform Android Things at this MWC show. The chip is also the only 4-core LTE chip in the world that supports Android Things, and is a specification that is not available for some other Android Things processors.
The launch of Qualcomm's LTE chip will be a good thing for Google, because it means that Android Things will no longer be limited to Bluetooth and Wi-Fi networking specifications, providing greater flexibility for Google's own platform. As for how future OEMs and developers will introduce Snapdragon 210 into Android Things device development, it is also worthy of attention.
In the field of smart home networking, Qualcomm also announced that it will release a new three-mode dual-core SoC "QCA402X" series developed for the Internet of Things. There will be two versions of QCA4020 and QCA4024, among which QCA4020 supports Bluetooth Low Energy 5 and dual-band Wi-. Fi and 802.15.4 technologies, including ZigBee and OpenThread. The two chips are equal to Qualcomm's first "15.4" chip, which means that Qualcomm attaches importance to supporting the smart home Internet of Things standard.
In addition, this series of Qualcomm IoT chips will also include features from Qualcomm's recently announced "Network IoT ConnecTIvity Platform", including pre-integration support for HomeKit, OCF, and the adoption of the Amazon Web Services (AWS) IoT Software Development Kit (SDK). ) or cloud services developed by Microsoft Azure SDK.
Qualcomm has already released the company's ambitions for its 5G NR and Snapdragon X20 chips, and its own IoT and RFRE technologies. It is expected that Qualcomm will release new technologies. After the completion of the acquisition of NXP, the layout of Qualcomm's IoT technology is expected to expand further, and the process of own 4G and 5G technology will continue to be promoted.
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