The application of high-power LEDs is expanding, but the problem of heat dissipation is still a headache for manufacturers. Now, the thermal analysis of LED package can be performed by calculating the power analysis model to reduce the complexity of the initial design of the product and speed up the time to market.
High-power, high-brightness light-emitting diodes (LEDs) are gradually cutting into many lighting applications due to their good color saturation and long-lasting life. However, how to avoid overheating of LEDs is a major test that thermal design engineers must face. In the design process, the importance of Computational Fluid Dynamic (CFD) models has become increasingly prominent. In this article, high-power LEDs using a star-shaped metal core printed circuit board (MCPCB) will be compared, and the results of the experiment with and without the heat sink will be provided. After a comparative discussion, an application will be provided in the LED package with the heat sink. On the temperature model building technology, it seems that the results obtained by the CFD model are quite feasible, and it also shows that this technology can be applied to the evaluation of the LED system level. The article will discuss the use of heat dissipation on the LED package. The effect of the interface material (TIM).
Estimated LED cooling to simplify product design
Being able to pre-evaluate the thermal performance of LEDs is a fact that can help design engineers effectively shorten the time to market for LED products . However, when thermal energy flow and package density are higher, the thermal design of LED package modules is It becomes more difficult, and the design of the module and thermal energy analysis are more important. Therefore, the simulation of CFD has become a common method used in thermal energy analysis in the early stage of electronic product design. CFD mainly includes related procedures such as fluid flow, heat conduction and heat radiation. Numerical simulation analysis.
This article proposes the steps to create a high-power LED star package with a heatsink. First, build a detailed model for a star-based LED package, then add a heat sink to the bottom of the LED star package, and finally simulate The results were compared with experimental data.
Another important point of the article is the impact of TIM on the LED package. The main purpose is to find out the characteristics of the Bond Interface Thickness (BLT) thermal interface material and the percentage of voids in the material.
Sensor Trash Can,Foot Sensor Automatic Dustbin,Foot Sensor Dustbin,Foot Sensor Trash Can
NINGBO ZIXING ELECTRONIC CO.,LTD. , https://www.zixingautobin.com