Unpackaged LED luminaire with secondary optics design

The novel unpackaged LEDs have better heat dissipation conditions, while integrating epitaxial, die and package processes, making it easier to pair with secondary optics to design lighting fixtures...

LED light source applications will gradually shift to LED general lighting applications after the peak demand for LCD backlight applications. However, unlike the LCD backlight module design, the LCD backlight module does not need to consider the optical and lighting application conditions, and the luminous efficiency requirements of the unit module are the main requirements; however, in addition to the brightness requirements, the LED lighting application must additionally consider the optical type. , heat dissipation, whether it is conducive to secondary optical design, and the requirements of the design and configuration of the luminaire , in fact, the requirements for LED light source components are higher.

Early packaging technology limits multiple heat dissipation issues affecting high-brightness design development

Early LED light source components, packaging materials mainly used in the shell-type package, in the early use of high luminous efficiency blue LED is quite common, and in the smart phone, mobile phone products thin design needs, the use of surface adhesion (surface-mountdevices; SMD The demand for LED light sources is increasing, and the LED light source components designed with surface adhesion technology can accelerate the production processing efficiency by using tape and tape loading materials, increase processing efficiency through automated production, and bring LED packaging. The new application market of technology, coupled with the subsequent advancement of epitaxial structure and packaging technology, is mutually reinforcing, and the luminous efficiency of LED light source materials can gradually surpass the performance of traditional lamps.

In view of lighting application requirements, lighting fixtures have higher and higher requirements for luminous performance, and LED light sources are currently the key to the optical output performance. The luminous efficiency is mainly represented by epitaxial, die and packaging technology solutions. At present, the unit luminous efficiency of epitaxial has been approaching the limit, and the space for luminous efficiency to jump and grow is relatively limited. Continuously increasing the grain area and improving the packaging technology is a feasible solution that can greatly increase the luminous efficiency of a unit component. However, if the cost performance of components can be improved, the increase in die area will be less cost-optimized, but the choice of packaging technology will directly affect the cost of the terminal material components. That is to say, packaging technology will become the cost of LED lighting. .

Wafer-level package introduction LEDs are small in size and highly reliable

Chip Scale Package (CSP) is the most popular packaging technology solution in the LED industry in 2013. In fact, CSP is not a new technology in the semiconductor industry, but it is still a novel advanced technology in the application of LED light source components. The purpose of the traditional semiconductor wafer level packaging application is to reduce the final volume of the packaged components, while improving heat dissipation and improving the application reliability and stability of the wafer itself. The wafer level package of the LED light-emitting component is mainly defined as the package body is close to the LED chip or the package volume is not more than 20% of the wafer, and the wafer-level packaged LED itself must also be a functionally complete package component.

Wafer-level packaging is mainly to improve the continuous increase of logic chip pins, component heat dissipation performance and wafer miniaturization. Through the integration benefits of wafer-level packaging, the parasitic phenomenon of the components of the wafer can be reduced, and the component integration of the Level 2 package can be increased. The application level of the wafer level package in the LED light source device can also achieve a significant degree of benefit.

A typical wafer-level package does not require an additional secondary substrate, lead frame, etc., but the wafer can be directly attached to the carrier. The wafer-level package is used to fabricate the P/N electrode of the LED diode at the bottom of the wafer. The surface mount automation method can be used for component assembly. If it is necessary to wire the component manufacturing process, the wafer level package can relatively improve the assembly and test process, and achieve the dual purpose of reducing processing complexity and cost.

The LED chip-level packaging solution enables components to achieve better heat dissipation performance, high lumen output, high package density, more flexibility, and simplified substrate. At the same time, the wire bonding process is reduced and the reliability of the terminal components can be improved.

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