Throughout the current LED packaging industry, some enterprises have undergone large-scale transformation, explored the market of pan-lighting, seek diversified development, and acquire new high-growth growth points. Among them, CSPs with new high-margin chips have become the enterprise. Phase development hotspots.
Since its establishment in 1997, Shenzhen Guangshe Lighting Technology Co., Ltd. has always regarded technological innovation, especially original innovation, as the cornerstone of the company's survival and development, and attached importance to basic research. Breaking through the technical bottleneck that traditional LED can only "directional illuminate", invented the world's first "360-degree space LED".
The "Flip-Chip LED Chip" (CSP) "Insulating Adhesive Conductive Technology" developed this time has been applied to CSP LED conductive bonding after nearly ten years of research and development. It is combined with prior art eutectic technology and reflow soldering. Technology coexists, forming a three-legged pattern.
According to the person in charge of Guangshe Lighting, "This LED flip chip solid crystal conductive bonding structure (commonly known as 'insulating adhesive conductive technology') uses 'solid crystal insulating rubber' to directly bond the pad to achieve 'metal-metal 'Electrically conductive bonding. Compared with the prior art, the technology has the advantages of simple process, low cost, high efficiency and wide application, and is currently at the international advanced level."
Since the technology adopts "solid crystal insulating rubber" for direct bonding, the external quantum effect can be improved in the technical index, the thermal resistance is lowered, and the light effect is improved.
In addition, in terms of use, it can be used not only for CSP flip chip, but also for integrated circuit manufacturing, communications, biotechnology, solar power, aerospace and other fields.
According to the person in charge of Guangshe Lighting, “this technology greatly simplifies the production process and opens up a new path for the popularization of CSP.â€
Customer Reviews:
"A kind of LED flip chip solid crystal conductive bonding structure" was highlighted by the outstanding achievements of the 13th China Scientists Forum.
About Guangshe Lighting:
360° LED professional manufacturer - Shenzhen Guangshe Lighting Technology Co., Ltd. Since its establishment in 1997, our company has made scientific and technological innovation, especially original innovation, the cornerstone of the company's survival and development, attaches importance to basic research, and pays attention to interdisciplinary innovation. Breaking through the technical bottleneck that traditional LED can only "directional illuminate", invented the world's first "360-degree space LED". In the technical field of “de-alumination†of radiators, we have innovatively proposed a technical solution for replacing LED fluorescent lamps with aluminum radiators. This technical solution greatly reduces the cost of LED fluorescent tubes and clears the popularity of LED fluorescent tubes. The obstacle.
In 1997, "Shenzhen Guangshe Trading Co., Ltd." was established.
1998 market research "white LED feasibility".
In 1999, the "White Light LED Laboratory" was established. And in the "Pearl River Delta" to promote "white LED packaging technology."
Developed in the laboratory in 2004, the patent "family eye LED".
Developed in 2005, the patent "adaptive 360-degree body-emitting white light-emitting diode".
Developed in 2007, the patent "360 degree white light emitting diode".
In 2010, the company name was changed to “Shenzhen Guangshe Lighting Technology Co., Ltd.â€. Developed in the same year, the patent "an LED fluorescent lamp without a metal radiator".
Developed in 2011, the patent "LED fluorescent lamp", "straight tube type LED bulb".
Developed in 2012, the patent "high-efficiency space-emitting LED components".
In 2013, the “Light Quality†trademark was registered.
Developed in 2014, the patent "a 360-degree space LED - SMD bracket", "an LED candle light bulb radiator".
In 2015, the invention invented the "insulating adhesive conductive" technology, simplified the "CSP - flip-chip LED solid crystal process", and applied for invention patents.
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